PCB에 355nm UV 레이저 마킹 머신 적용
Sep 24 , 2021
UV laser marking machine is the best choice for various PCB material applications in many industrial fields, from the production of the most basic circuit boards, circuit wiring, to the production of pocket-sized embedded chips and other advanced processes. This material difference makes the UV laser marking machine the best choice for various PCB material applications in many industrial fields, from the production of the most basic circuit boards, circuit wiring, to the production of pocket embedded chips and other advanced processes. Universal.
Ultraviolet laser marking machine etches the surface pattern on the circuit board at high speed
The UV laser marking machine works quickly when producing circuits, and the surface pattern can be etched on the circuit board in a few minutes. This makes UV lasers the fastest way to produce PCB samples. More and more sample laboratories are equipped with internal UV laser systems.
Depending on the verification of optical instruments, the size of the ultraviolet laser beam can reach 10-20 μm to produce flexible circuit traces. Ultraviolet rays have the greatest advantage in the production of circuit traces. The circuit traces are extremely small and can only be seen under a microscope.
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UV laser marking machine flexible cutting pcb
UV laser marking machine cutting is the best choice for large or small production, and it is also a good choice for PCB disassembly, especially when it needs to be applied to flexible or rigid-flex circuit boards. Disassembly is the removal of a single circuit board from the panel. Considering the continuous increase in material flexibility, this disassembly will face great challenges.
UV laser marking machine cuts PCB without damage
Mechanical disassembly methods such as V-groove cutting and automatic circuit board cutting are prone to damage sensitive and thin substrates, which cause problems for electronics manufacturing service (EMS) companies when disassembling flexible and rigid-flex circuit boards.
Ultraviolet laser marking machine cutting can not only eliminate the influence of mechanical stress generated during the disassembly process such as cutting edge processing, deformation and damage to circuit components, but also have less thermal stress influence than other laser disassembly such as laser cutting.
"절단 버퍼"의 감소는 공간을 절약할 수 있습니다. 즉, 구성 요소를 회로의 가장자리에 더 가깝게 배치할 수 있고 각 회로 기판에 더 많은 회로를 설치할 수 있으므로 효율성을 극대화하고 유연한 회로 응용 프로그램의 최대 한계에 도달할 수 있습니다.