세라믹 회로 기판의 그린 레이저 디패널링

LPKF의 레이저 디패널링 시스템을 사용하면 세라믹 재료로 만든 인쇄 회로 기판을 다양한 다른 재료와 함께 가공할 수 있습니다. 절삭날은 기술적으로 깨끗하고 매우 정확하며 비용 효율적으로 생산됩니다.

세라믹 PCB의 특성

Due to their excellent thermal conductivity and low coefficient of thermal expansion, ceramic printed circuit boards are preferably used in the high-performance sector. In addition, the material ceramic is characterized by its excellent chemical errosion resistande and mechanical hardness.

Especially because of their extremly hardness, the materials are barely machinable with the help of mechanical cutting processes such as milling or sawing.

Application of ceramic circuit boards

Ceramic printed circuit boards are used in a variety of different applications that have increased demands on robustness and reliability of the boards. These include, for example:

Automotive industry: e.g. sensor/radar modules, ESC/ABS and EMS

Medical technology: e.g. MEMS (Micro-Electronical-Mechanical Systems)

Telecommunication: e.g. RF modules

Aerospace: e.g. shockproof circuits

Further: e.g. camera modules