고전력 uv 레이저 절단 PCB의 일부 문제
Aug 30 , 2021The investment cost of buying PCB laser cutting machine and board splitting equipment is relatively high, and the purchase process also needs to be more rigorous. Compared with other PCB sub-board equipment, the technical threshold of PCB laser cutting machine is higher, and there are more technical materials that need to be referred to. As a customer, these unfamiliar materials are rather raw and difficult to understand. How to understand PCB laser cutting and boarding equipment, RFH laser will provide you with reference through this article.
As a manufacturer, the first thing we need to understand is the customer's requirements, and recommend related models according to the requirements, for example, whether the material of the PCB is aluminum substrate, epoxy resin, FR4, glass fiber board or paper substrate; the size of the PCB product , Whether there is a V-groove, the thickness of the product, etc. are all very important reference conditions.
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According to the recommended equipment, aluminum substrates and copper substrates are generally selected for QCW fiber laser cutting machine sub-boards. In the early days, CO2 laser cutting machines were also used for sub-boards. With the advancement of technology, they are gradually replaced. Other materials choose green light or ultraviolet. PCB laser cutting machine.
The PCB laser cutting machine can meet the requirements of smooth cross-section without burrs, no stress and no deformation of the board, and can separate the PCB with components. However, the processing speed will have an impact on the processing effect. The recommended equipment here is UV PCB laser cutting and splitting machine and green PCB laser cutting and splitting machine. When using ultraviolet laser equipment, the processing effect is better, but the efficiency is lower. When using green laser equipment, the processing effect is not as good as ultraviolet, but the efficiency is higher. At the same time, the thicker the board material, the lower the processing efficiency, and the processing effect is relatively poor. Of course, this has a lot to do with speed. Even a 2mm board can be completely black without considering the speed. In terms of processing speed, the better the material absorbs light, the faster the speed. For example, the processing speed of the paper substrate of the same thickness is faster than that of the epoxy resin material. The higher the power of the laser, the higher the single pulse energy and repetition frequency, and the faster the cutting speed.
The processing method of the PCB laser cutting machine is to scan through the galvanometer back and forth, so there are two references for the processing format of the galvanometer and the processing format of the worktable. The processing format of the galvanometer refers to the working area of a single processing. The effective format of the table is the effective parameter for the PCB size. In addition to the aluminum and copper substrates in the processing gap, the general material laser splitting machine can be controlled within 100 microns, and the thinner board can be controlled within 50 microns. The thinner the board, the smaller the processing gap.
The carbonization phenomenon is actually a manifestation of the processing effect. Carbonization is not a phenomenon in the cut surface, but in the cut section. On the one hand, the carbonization is caused by the thermal influence of the high-energy beam gasification process, and on the other hand, the smoke generated during the gasification process adheres to the cross section. How to effectively avoid this problem, on the one hand, is to increase the laser processing frequency, pulse energy and average power during processing. The other is to reduce carbonization by reducing the cutting speed, plus some auxiliary dust extraction devices. Of course, demanding customers want to avoid blackening at all. This is also achievable, but the efficiency is very low and it is difficult to be compatible.
위의 사항은 고객의 문제에 대한 PCB 레이저 절단기 및 분할 기계 장비 제조업체의 요소입니다. 고객으로서 현재 레이저의 장단점을 이해하고 필요에 따라 균형 잡힌 솔루션을 찾아야 원하는 레이저 가공 장비를 선택할 수 있습니다.
