DPSS 고체 레이저 uv 소스와 녹색 레이저의 차이점은 무엇입니까

 

녹색 레이저와 자외선 레이저의 차이점은 세계적으로 유명한 브랜드 Coherent Corporation에서 출시한 새로운 녹색 레이저와 자외선 레이저를 예로 들어 보겠습니다.

 

이 두 가지 새로운 녹색 레이저는 마이크로전자공학, 광전지 및 관련 산업에서 마이크로프로세싱 응용 분야의 성능을 확장하고 개선합니다. 특히, 355-55 UV 레이저는 150kHz의 높은 펄스 반복률과 355nm에서 55W의 평균 출력을 가지고 있습니다. 532-80 녹색 레이저는 532nm 전력에서 1mJ 펄스 에너지를 생성할 수 있으며, 이는 80kHz의 최대 펄스 반복 주파수에서 80W 평균 전력으로 변환될 수 있습니다. 오늘 우리는 녹색 레이저가 신체에 미치는 영향에 대해 이야기할 것입니다.

 

자외선 레이저  | 녹색 레이저  | 자외선 레이저  | 자외선 dpss 레이저  | 나노초 레이저  | UV 레이저 소스  | 고체 레이저

먼저 FPC 커버 필름이 무엇인지 알아보겠습니다.

Flexible circuit boards (FPCs) are widely used in electronic products due to their light weight, high wiring density and thin thickness.

There is a layer of resin film on the surface of FPC, which plays the role of line protection and solder mask. It is an important part of FPC products. Because its main component is polyimide (PI), it is also called in this field. PI cover film, which is a high-temperature polymer with imide cyclic structure on the main chain of the molecule, has outstanding dielectric properties, mechanical properties, radiation resistance and wear resistance at high temperatures, and is widely used. In the fields of precision electronics such as aviation, electronics and electrical appliances.

 

At the same time, in the actual production process of FPC, due to the needs of the process, a layer of semi-cured epoxy resin adhesive will also be coated on the surface of the PI cover film, and a layer of release paper will be pasted on the surface of the adhesive to protect The adhesive is not contaminated, so the PI cover film for FPC is not just a one-component material, it is a composite film containing at least two chemical materials.

 

Difference Between Green Laser and Ultraviolet

Green lasers can be used to cut flexible substrates and thin printed circuit boards, where high lateral resolution is an important consideration.

 

The higher power currently available with the 355-55 UV laser extends cutting capabilities to >200μm flexible and multilayer materials.

 

The 532-80 Green Laser can be used for scribing, drilling, and grooving, as well as cutting flexible substrates that effectively absorb green wavelengths, including certain printed circuit board substrates, semiconductors, and photovoltaic modules.

 

The photochemical principle of green laser laser cutting PI material: the single photon energy of the laser can reach or exceed the chemical bond energy of the material, and the bond energy of the chemical bond of the C-C bond and the C-N bond of the PI material is broken, so as to achieve the purpose of cutting.

 

Popular science: unit conversion

1ms (milliseconds) = 0.001 seconds

1μs (microseconds) = 0.000001 seconds

1ns (nanoseconds) = 0.000000001 seconds

1ps (picoseconds) = 0.000000000001 seconds

1fs (femtoseconds) = 0.000000000000001 seconds

 

There have been early attempts to use lasers for micromachining. However, due to the long pulse width and low laser intensity of the laser, the material melts and continues to evaporate. Although the laser beam can be focused into a small spot, the thermal shock to the material is still large, which limits the processing accuracy. Only by reducing thermal effects can the machining quality be improved.

 

Difference Between Green Laser and Ultraviolet

The difference between green laser and ultraviolet and the characteristics of green laser:

1. Advanced laser and core components, good beam quality and high power stability;

2. Years of process tuning and optimization, focusing on spot quality, good cutting effect and high efficiency;

3. The equipment is equipped with an optical platform, a 00-grade precision marble platform, a high-speed and high-precision linear motor and a negative pressure adsorption system, with precise positioning and high processing stability;

4. There are two different models of manual loading and unloading and automatic loading and unloading, which can be customized according to customer needs.

green light

Advantages of the difference between green laser and UV:

1. Using nanosecond / picosecond, ultraviolet / green laser, cold light source, laser cutting heat affected zone is particularly small to 20μm;

2. The minimum focusing spot can reach 10μm, which is suitable for micro-cutting and drilling of any organic & inorganic materials;

3. CCD visual pre-scanning & automatic target grabbing positioning, processing range can be expanded to 280mm×500mm, XY platform stitching accuracy ≤±5μm;

4. Support a variety of visual positioning features, such as cross, solid circle, hollow circle, L-shaped right-angle edge, image feature points, etc.;

5. The manipulator automatically loads and unloads the material and cuts the IC fingerprint identification chip. It takes 3 seconds for a single grain.