한국 고객을 위한 고출력 녹색 레이저 디패널링 PCB/FPC
Feb 02 , 2023High power green laser depaneling PCB/FPC for South Korea customer
High power green laser depaneling or part excising can cut through metals, plastics, dielectrics, or a combination of both.
These high power green laser processes have the advantage of speed, positional accuracy, no tooling cost or wear, no part induced stresses, and no cutting oils or other contaminants.
High power green Laser scoring
High power green Laser scoring produces a limited depth ablation line in the part or material set. The depth is generally 50% of the material thickness but can be controlled to a desired depth. The scoring acts similar to the hold-tab to secure the part in the panel or sheet, but allows for individual parts to be ‘snapped’ out. Laser scoring lines can also be used as a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into shape without expensive forming dies.
Perforations
Similar to scoring or v-grooves, high power green laser perforations are another option for tool-less part removal from a panel or sheet. Perforations can be laser formed to any size and spacing to meet the desired removal and securement forces.
RFH에서 개발 및 생산하는 Expert III 532 시리즈 녹색 DPSS 레이저는 짧은 펄스 폭(<25ns@50K), 우수한 빔 품질(M²<1.2) 및 완벽한 레이저 스폿 품질(빔 원형도 >90%)로 35w의 레이저 출력을 처리합니다 . . 금속 표면에서 산화물 층을 제거하는 것과 같은 대부분의 금속 및 비금속 재료에 대한 유리 마킹, 박막 에칭 및 표면 처리에 적합합니다.
