RFH의 고객은 15w 및 20w UV 튜브 절단 PCB 회로 기판을 구매합니다.

 

계약 제조에서 레이저 절단 서비스 제공업체로서 당사는 1989년부터 성공적으로 사업을 운영해 왔습니다. 다양한 재료의 인쇄 회로 기판과 회로 기판을 효율적이고 깨끗하며 비용 효율적으로 절단합니다.

열 손상이 감소된 UV 레이저 다이오드 커팅 PCB

UV 또는 USP 레이저로 회로 기판 처리

자외선(UV) 레이저 또는 초단파 펄스(USP) 레이저는 재료 가공을 위한 보편적인 도구입니다. 정밀하게 초점을 맞춘 레이저 빔은 다양한 재료 및 회로 기판 유형에서 매우 미세하고 깨끗한 윤곽을 생성합니다.

 

다층

유연한 회로 기판

리지드 플렉스 보드

얇고 단단한 기판

탭 라우팅 패널

HF 재료

복합 재료

 

Innovative Laser Cutting Processes and Technologies

Cutting Through Multiple Layers

The focused laser beam reliably cuts through all layers in one or several passes and can be set to defined depths. It is suitable, e.g., for separating rigid and flexible circuit board components in multilayers or for cutting films made of thin and sensitive materials.

 

Material-Friendly, Noncontact Material Processing

The unpopulated materials to be processed are held in place by a vacuum table without the use of clamping tools. Due to the noncontact nature of the processing, there is no warpage, even in thin materials – this gives the process a clear advantage over milling or punching.

 

ESD-Compatible Carrier System

For circuit card assemblies (assembled circuit boards), an ESD-compatible carrier system that securely holds the individual panels in place during and after singulation is used. The parts are additionally protected against unintentional damage. All carriers are designed by our specialists and manufactured in-house.

No Burring

The UV/USP laser used vaporizes the material that is struck, so no burr forms. The minimal heat-affected zone prevents delamination of the material composites.

 

CleanCut Process

For meeting especially high demands, the so-called CleanCut process is used with a USP laser. This process guarantees the highest edge quality without smoke residues or particle buildup.

The results of laser cutting are precise, nearly radius-free contours. The cut edges are smooth, vertical, and clean – even with the most complex of geometries. The process ensures maximum dimensional stability, edge quality, and throughput.

 

Advantages of 15w and 20w UV tube Laser Cutting

 

Clean cut edges without burr or dust formation

Cutting of extremely fine contours and practically radius-free inner edges

Minimal thermal effects, i.e., no delamination

Laser cutting of various material thicknesses and combinations in a single operation

Singulation of assembled circuit boards

No clamping device or protective cover necessary

Maximum board utilization because no space has to be kept free for cutting channels